Browsing by Subject "5G 6G ARTIFICIAL INTELLIGENCE OF THING (AIOT)"
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Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G
(Micromachines (Basel), 2021)Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial ...